End-to-End Service Capability
From design review and prototyping to mass production and global delivery — we work side by side with our customers.
Our Process
Transparent, controlled, on-time delivery
Requirements Analysis
In-depth consultation to capture technical specs & delivery requirements
Solution Design
DFM analysis + full BOM optimization
Production
Fully automated SMT lines + strict QC
Global Delivery
3-7 working days to major regions
Core Capabilities
PCB Fabrication
1-32 layer rigid / 4-8 layer flex / rigid-flex; trace/space 3mil/3mil; impedance tolerance ±5%.
SMT Assembly
YAMAHA fully automated lines; 01005 placement; BGA / QFN / QFP specialty.
IC Components
Authorized distributor for TI / ADI / ST / NXP / Microchip; full traceability from franchised channel.
AOI / X-Ray Inspection
100% AOI + X-Ray sampling; 100% X-Ray for BGA/CSP to ensure zero-defect delivery.
Testing & Burn-in
ICT / FCT fixture development; temperature & burn-in screening for outgoing quality.
Global Logistics
DHL / FedEx / UPS direct shipping; DDP / DAP terms; coverage in 50+ countries.
Certifications & Compliance
2015 质量管理体系认证
符合欧盟环保指令要求
UL 认证 / IATF 16949
